Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX.
Investigation of the joint condition and joining methods of crimp terminals, as well as the types of materials! Introduction to cross-sectional observation and elemental analysis using SEM/EDX.
I would like to introduce the topic of "Cross-sectional observation of copper terminals and elemental analysis using SEM/EDX." We conducted cross-section preparation of the joint area of the copper crimp terminal fixture for resistance measurement, applied chemical etching to the prepared cross-section, and observed the metal structure before and after etching. As a result, we infer that the detected elements are P (phosphorus), Ag (silver), and Cu (copper), indicating that it is a silver-containing phosphorus copper solder material. *For more details, please refer to the PDF document or feel free to contact us.*
- Company：アイテス
- Price：Other
